视频概述

简介

被遗忘多年的MacBook Air,终于在今年被苹果升级更新换代。这款新的轻量级产品能在2018年满足人们对超便携笔记本的需求吗?或者只是一个烫手的山芋?让我们通过拆解来得出答案吧。

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这个拆解是不是维修指南。 要维修你的的MacBook Air 13” Retina Display Late 2018,请使用我们的服务手册

  1. 首先让我们摸清Air的配置:
    • 首先让我们摸清Air的配置:

      • 13.3英寸LED背光IPS视网膜显示屏,分辨率2560 X 1600(像素密度227PPI)

      • 1.6GHz双核英特尔酷睿i5处理器(可睿频加速至3.6GHz),集成英特尔UHD Graphics 617显卡

      • 苹果T2定制安全芯片/协处理器

      • 8GB的2133MHz LPDDR3 SDRAM

      • 128GB基于PCI-E的SSD

      • 802.11ac Wi-Fi以及蓝牙4.2

      • 两个雷电3(USB-C)接口,同时支持充电、DisplayPort、雷电以及USB3.1 Gen 2

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  2. 在正式进入内部冒险之前,先花点时间探寻这台Air的外观。
    • 在正式进入内部冒险之前,先花点时间探寻这台Air的外观。

    • 机身底部下方我们找到了些镭射“花纹”和一些P型梅花螺丝。

      • 看来我们找到了些新数字!Model A1932和EMC 3184。

    • 翻起屏幕,我们看到了熟悉的第三代蝶式结构键盘,让我们想起了MacBook Pro.

    • Air同无Touch Bar的13英寸MacBook Pro极为相似,除去厚度与Touch ID,其他几乎没有差别。

    • ···虽然冠以“Air”的称号,但当12英寸的MacBook加入对比,却显得并没有那么轻薄。

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    • 当然,如果没有X光的窥探,那么外观的测评是不完整的。

    • 在我们的老朋友Creative Electron的帮助下,我们得到了一些内部的预览

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    • 在拆解之前,再稍微走走远路:我们无法抗拒拆解我们最喜欢的“command”键,进而查看噪音隔绝措施 防入侵薄膜。

      • 无论你是否爱它,它就在那里,像一只蝴蝶静静地待着。

    • 使用我们的P型梅花螺丝刀取出螺丝,弹开固定着底板的两个卡扣,我们拆入了机身内部。

      • 同我们最近在MacBookMacBook Pro找到的充满陷阱的底板相比,Air简单的拆解方式让我们露出了微笑。

    • 在机身内部,我们找到了:一块小小的主板、一个孤单的风扇、一对大型长条扬声器以及一个有趣的鳍式散热器。

    Looks like you took a bite out of the ribbon cable over the fan!

    Malcolm Hall - 回复

    • 仅取出6颗TR型梅花螺丝断开一些排线,我们同主板之间的隔阂便被消除—完美!没有什么是我们Marlin螺丝刀组件不能解决的。

    • 主板拿出!Air的主板没有Pro的那么大胆,又没有MacBook的那么不起眼。

      • 到目前为止,一切都还那么简单,但我们更想看到可升级的组件或是更直接拆卸电池的设计,而不是在现在便能拆出主板(众所周知,这与设备的使用寿命息息相关)。

    • 接着我们拿出了子板,其上带有一个高度濒危的耳机接口以及一些用于连接扬声器和Touch ID的排线。

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    • 这块主板看起来可能很小,但却能提供不错的处理能力:

      • 英特尔(Intel)SREKQ酷睿i5-8210Y处理器

      • 苹果(Apple)APL1027 339S00535 T2协处理器

      • 闪迪(SanDisk)SDSGFBF12 043G闪存(共计128GB)

      • 英特尔(Intel)JHL7540雷电3控制器

      • 338S00267-A0(可能是苹果的电源管理集成电路)

    The Apple T2 Chip is already almost as large as the Intel i5 Chip. Imagine what will happen in a few years when ARM is replacing x86-64 on MacBook.

    Yang Jackie - 回复

    • 我们把主板翻了个面并找到了更多的芯片:

      • 两颗SK海力士(SKhynix)H9CCNNNCPTAL LPDDR3 RAM(共计8GB)

      • 村田制作所(Murata)339S00446 1ZE SS8915047(可能是Wi-Fi模组)

      • Intersil 95828A HRTZ X829PMJ

      • 恩智浦(NXP)80V18 安全NFC模块

      • 旺宏电子(Macronix)MX25U3235F串行多I/O闪存

      • 德州仪器(Texas Instruments)CD32-15C00电源控制器

      • 德州仪器(Texas Instruments)TPS51980A同步降压转换器

    I believe that TI’s CD3215C00 is a USB 3.1 redriver.

    https://forum.hddguru.com/viewtopic.php?...

    Franc Zabkar - 回复

    • 耳机接口的对面,我们找到了一个超级模块化设计的雷电接口!

      • 对于我们来说,这台MacBook开了一个良好的开端—所有的接口都在各自的模块上并且易于更换。

    • 最后我们遇见了在这台“空气”中负责调节空气的组件···

    Can I just point out how much like a Lightning connector the “guts” of a Type-C connector is? Have we found a double-sided Lightning connector in the wild yet, maybe in the iPad Pro USB 3 Camera adapter?

    Scott - 回复

    • 继续!维修友好型的设计(或者说更加友好)我们找到了扬声器之下的易拉胶!

      • 我们并不喜欢粘合剂—可重复使用的螺丝更加友好—但,这种iPhone式的易拉胶比盲目地使用溶胶剂并疯狂撬电池来的好

      • 另外,只有易拉胶的存在,说明了有人想要提升整机的可维修性和拆解可能性。

      • 你看到了吗,苹果?能否听听我们的请求?

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    • 继续,将注意力转向触控面板。

    • 同上来便能拆解触控板的最新MacBook Pro不同,Air的触控板被安置在主板之下,并且同键盘公用一根排线。

      • 看起来触控板的维修都必须先拆除主板。

    • 随着触控板的取出,我们不禁联想到了某台TIE战斗机

    Are you certain that the split in that trackpad cable over the center battery wouldn’t allow a bit of “service loop”, just enough to disengage the cable connector from the socket on the trackpad with a spudger without needing to remove the logic board? Seems a rather conspicuous cable design to not provide some benefit. If anything, I’d bet that flexing that cable split does yield some length, yet also leaves permanent (no warranty for you!) evidence it was done.

    Scott - 回复

    No guarantees, but it didn’t look like it could be done safely. The end of the cable is also pretty firmly glued to the trackpad near its socket, so getting it off would be tricky, and there’s not really any slack to speak of. The photograph that has been circulating from Apple’s internal service manual for replacing the battery also appears to show the logic board removed.

    Jeff Suovanen -

    Wow, ugh. Thanks for the reply. Once again, Apple’s “master” Designers do (seemingly) really stupid things.

    Scott - 回复

    • 感谢来自MacRumors的帮助,让我们感觉到拆解这台设备的电池可能没某台视网膜显示屏的设备那么难。

      • 果然,我们找到了四颗螺丝和六条友好的易拉胶用于固定为Air提供AirPower电源的电池。

    • 一个坚固的框架,就像是旧版本的Air,用于支撑电芯并且让更换变得简单。

    • 这里是参数:49.9Wh能量,如果你进行多家对比,你会发现这比戴尔(DELL)新的XPS 13(52Wh)小一点,但比微软(Microsoft)Surface Laptop 2(45.2Wh)和惠普(HP)即将推出的Spectre X360(43.7Wh)更大。

      • 所有的这些设备都声称支持10+小时的续航,但作为Air的对手的他们,却带有运行更快功耗更高的英特尔U系列处理器。

    Are the battery cells terraced / wedge shaped or the same Z-height throughout? I can’t quite make that out from the photos…

    repoman27 - 回复

    The batteries are not terraced and reside in the same plane. All three cells are laid flat on top of the metal tray.

    Arthur Shi -

    • 我们几乎能看到拆解的终点了。

    • 金属天线支架和新的(模块化!)的Touch ID传感器依旧留在电池上方的空间内,其均被T型梅花螺丝固定。

    • 在卸下一些T型梅花螺丝后,显示屏便能取出了!这块新视网膜面板几乎和MacBook Pro上的一样,区别在于最高亮度(Air的300尼特与Pro的500尼特)以及P3色域的支持

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    • 我们把这台MacBook Air摆放在这,好让你们能观察其内部组件!

    • 新MacBook Air采用模块化的接口以及易拉胶,同在可维修性不断下降的其他苹果笔记本形成了鲜明的对比。

    • 不过,你还是需要跟P型梅花螺丝进行思想工作,内存和存储都还是不可升级。虽然这种升级比起DIY爱好者更适合与有经验的技术人员。不过我们希望这些只是MacBook回归更易维修阵营的第一步。

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  4. 最后的想法
    • 许多组建都是模块化的,并且易于维修—包括接口、风扇和扬声器。
    • 刨除有点讨厌的P型梅花螺丝,这台笔记本还是相当容易拆解的。
    • 电池使用螺丝和易于维修的易拉胶固定—不过你还是需要将主板和扬声器移除后才能进行拆解。
    • 键盘被整合进了C面,需要完全拆解才能进行维修。
    • 在1200美元的笔记本上出现焊接的、不可升级的存储和内存可不是个好现象。
    可修复性评分
    3
    可修复性10分中得3分
    (10是最容易修复)

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Am I losing my eyesight, or is that fan not directly connected to any type of heat dissipating hardware? Looks like it’s either just providing a general low-pressure-air-flow throughout the internals - OR - it pushes air back through that antenna/heatsink-bracket-type-thing and coming out the other end of it?

Could you confirm or explain this in more detail?

alexander.lagergren - 回复

I think it is just an exhaust fan, that removes hot air from a laptop case outside (from the right side of the case, under the screen) and creates a negative pressure inside, which helps a laptop to “suck“ some cool air from the outside through the intake on the left side of case, under the screen. The shape of the radiator ribs also suggests some airflow from left/right side of the case to the opposite side.

Serge B. -

The only thing that fan is doing is moving a (tiny) bit of air indirectly across the logic board and the heatsink. Or at least that is what I think it does. As there is no direct heat conduction from logic board to case, the fan isn’t there to cool the case, that’s for sure.

Federico Barutto -

Yeah it is just a case ventilation fan, it doesn’t blow any heatsinks directly. Although with the very low TDP of the processor, a case fan with radiator type heat sink should do the job.

Tom Chai -

Yes, as the 12” Macbook with a ~5W TDP chip manages without a fan, I’m sure a slower general airflow together with that heatsink works well for the 7W chip in the 2018 MBA.

And when looking closer - the vents on either side of the antenna bracket, that the fan exhausts through on one side - air is drawn in on the other side and then guided by the vanes in the ventilation holes, allowing it to flow easily from right to left (when viewing bottom/inside of the MBA) over the heatsink cooling fins. There doesn’t appear to be any other openings in the chassi, so Apple has probably designed the airflow pretty efficiently in this fashion.

Pretty cool! Only Mac laptop I’ve seen with a fan but without heat-pipes/sinks by the fan.

alexander.lagergren -

This thermal design reminds me of the old Titanium Powerbooks, especially the heatsink. That had two fans I believe, one pulling in from the side and one blowing out the back. I think this pulls air from one side of the monitor hinge vents and exhausts out the other.

Ian Holland -

Why don’t they use the aluminum body directly as a huge heatsink?

Haley Pearse -

You’ll notice that they’ve sealed the mid-area under the display bezel, with only an opening on the side furthest from the fan, nothing above the CPU, and an outlet the fan blows air out of.

I’m guessing they did this to cool both the low power, yet still warm T2, as well as draw air over the CPU.

It’s not blowing directly on a heatsink connected via heatpipe to the CPU, no, but I’m guessing they weighed up the pro’s and con’s of heatpipes, and decided that sucking air through a tightly controlled path is preferable to the bulk added by heatpipes.

It’s no different than the trashcan mac pro, is it? That just sucks air up over the heatsinks if I remember correctly.

What matters is that airflow is limited to a strict path, that’s in the left side of the laptop, over the T2 and SSD’s heatspreader, over the CPU’s radiator, through the fan, and out the right side.

Ryan Michell -

It’s really bad to know that neither storage nor RAM is upgradable. If I go for 128 GB SSD and 8 GB RAM then I can never upgrade them, disappointed :(

Amit Gupta - 回复

That is the main reason why you should avoid those Apple new laptops. The other one is that each of the Apple laptops has design flaws (and this has happened for many years) : check Louis Rossmann videos on youtube, this is eye opening.

https://www.youtube.com/watch?v=AUaJ8pDl...

Oli Wek -

When will the new iPad pro teardown be revealed plz. Deadly waiting for it

MotorBottle - 回复

They’re still heating up the glue.

timothytay -

Interesting, confirms what I thought in their render that showed the insides, that the fan was too close to the back for their usual spacing for a heatsink there. Looks like the fan just ambiently cools the chassis and moves internal air, rather than directly passes over a heatsink.

tipoo - 回复

These MacBook logic boards are gonna end up in iPhones soon if they continue shrinking

grahammcclure - 回复

lol that was a nice one :)

leartzajmi -

Not being able to upgrade RAM, fine, not the end of the world but if they had made the SSD upgradeable then this could have been a truly great machine.

Jon Lewin - 回复

The wifi module is interesting. Not Intel or Broadcom. Scouting around the internet, it looks like maybe it’s shared with the new iPad Pro??????

jridder - 回复

@grahammcclure

“These MacBook logic boards are gonna end up in iPhones soon if they continue shrinking”

I think you have that backwards.

fastasleep - 回复

I’m still confused about how the display data cables interact with the hinge. In the 2016 MBP teardown, I thought iFixit said they get rolled up or something. While the pictures in this teardown helped shed some light on this mechanism, I’d really like to see some detailed shots of how exactly that all works. Maybe in classic iFixit style where the position of just a few things within the frame changes seemingly magically between two pics. Thoughts/comments?

iEvan - 回复

Hey iEvan! This is a teardown, which is an entertaining (and abbreviated) peek inside the device, not a step-by-step disassembly guide, hence the “magical” changes. If you want to see how MacBook Air display cables and hinges interact, check out our MacBook Air display replacement guide, in concept the process hasn’t changed.

Sam Lionheart -

If I am reading this correctly, there is absolutely nothing about Battery being better positioned to be easily replaceable. Merely that Apple guidelines now allow Battery to be replaced without changing the top case.

That is Apple stopping all those who had Apple Care to get a new top case with their battery replacement or people getting ( used to ) getting around their Keyboard problem with battery replacement.

K Sec - 回复

Thanks for a great review. I’m really enjoyed your works. Thumbs up..

akmaljohar - 回复

I think this review just swayed me from Surface Laptop 2 to the new Air. I can live with two cores vs having to throw away the laptop at the first hurdle. Plus the resale value of all surface devices is, well, pretty much non-exitent. And for a good reason.

Marko Nesovic - 回复

What influence will the T2-processor have on repairing / replacing parts?

thekryz - 回复

Where is the hardware microphone disconnect?

Ben Leggiero - 回复

Why there is a NFC chip on board? Does MacBook Air even support NFC?

Yang Jackie - 回复

Or it’s some kind of secure enclave?

Yang Jackie -

Secure Enclave would be on the Apple T2; good question about that NFC if that’s its sole function

VaughnSC -

NFC chips tend to pop up on devices without NFC from time to time, the Droid Razr had one, I’ve seen them from time to time on other phones, and now this.

I’m half guessing they’re added on in production, and nearing the end NFC gets cut from the hardware for whatever reason and it gets left there.

I’m sure some schematics, or in time, Louis rossmann will work it out (when it dying ends up killing boards)

I’d say secure enclave, but that’s the T2’s job. Maybe the T2 (coughA10cough) depended on the NFC chip it expected on iPhones, so they through it on just to keep the thing happy? I wonder if the iMac Pro has one…

Still, I’d expect NFC to be a more Macbook thing, maybe a reader under the trackpad for pairing that got scrapped?

Ryan Michell -

Exactly what i thought: why not use case as heatsink?

Andru Nl - 回复

What about the hinges? Did you guys take a good look at them? Are they the same as the MBP, or did Apple use a different design? Wondering what their durability is going to be over the long term.

Lambert John - 回复

can this retina display be installed on old macbook air models? like early 2015 model

macklemore - 回复

comes with mojave oder high sierra? Dragon Dictate discontinued :-(

Michael Kraker - 回复

It comes with MacOS Mojave installed.

Arthur Shi -

So is there absolutely no way to replace the SSD in this machine?

planshet50082 - 回复

There is no way to replace the flash storage in any current Mac (MacBook Pro, mini, iMac, iMac Pro, and the Air) with a T2 chip acting as the storage controller/encryptor.

jbgurman -

Thank you for doing this guys.

Enrique Sandoval - 回复

Thank you very much for doing this. I had been turning away business on this MBA 2018.

Ted Horodynsky - 回复

So, is anyone going to buy it? I’m gonna change my ‘14 MBP 13’’ one day, but can make up my mind — base Air, Pro and 12” cost same.

Yoba Boba - 回复

Could I add external micro SSD to USB c I mean is there any space inside the laptop to put external SSD and connect it to USB c by mini USB hub? Will be a maybe good idea to add more storage

lovely.3raq - 回复

Aren’t there three identical SanDisk chips on the logic board? The two labeled ones on one side, and one unlabeled one on the other… doesn’t this mean that this MBA contains 192 GB of NAND?

GetalMearDolis - 回复

@getalmeardolis The “043G” on the package indicates a 43 GB chip. Three chips x 43 GB = 129 GB. (There’s probably some rounding to account for the extra GB.) But yeah, three identical chips!

Jeff Suovanen -

Complimenti ad Albertob per l’ottima traduzione!

nikanz - 回复

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