正翻译步骤 10
步骤 10
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The other side reveals:
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SKhynix H9HKNNNFBMAU-DRNEH 8 GB LPDDR4X SDRAM with the SoC Kirin 990 layered underneath
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Kioxia (Toshiba) M-CT041930U544311JPN 256 GB UFS
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HiSilicon Hi1103 Wi-Fi module (as seen in the Mate 20 X 5G)
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An empty pad, which apparently hosts an additional front-end module in the 5G version of this phone
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HiSilicon Hi6363 RF transceiver (as in the Mate 20 Pro)
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HiSilicon Hi6526 power management IC
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NXP 80T37 (likely NFC controller)
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