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正翻译步骤 9

步骤 9
With all those things crammed into the phone, the motherboard is shaped to fill the remaining space. Let's see what goodies we can find on this chocolate silicon bar: HiSilicon Hi6421 power management IC HiSilicon Hi6422 power management IC
  • With all those things crammed into the phone, the motherboard is shaped to fill the remaining space. Let's see what goodies we can find on this chocolate silicon bar:

  • HiSilicon Hi6421 power management IC

  • HiSilicon Hi6422 power management IC

  • STMicroelectronics BWL68 wireless charging receiver IC

  • Halo Micro HL1506F1 battery management IC

  • Dot projector

  • Microphone

  • Beneath the motherboard, we spot a copper plate running down the left of the frame. This is similar to the Mate 20 X 5G's liquid cooling system.

在此前取下的零件以外,主板塞满了剩余的空间。一起看看这块硅质巧克力条上有什么宝贝:

海思 Hi6421 电源管理集成电路

海思 Hi6422 电源管理集成电路

意法半导体 BWL68 无线充电接收集成电路

希荻微电子 HL1506F1 电池管理集成电路

点阵投影仪

麦克风

在主板下方,我们看见了一块紧贴左侧边框的铜板。这和 Mate 20 X 5G 的液冷系统很相似。

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