注：你正在编辑的一份前提条件指南。你所做的任何更改将影响包括此步骤的2指南。
正翻译步骤 29
步骤 29
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Reheat your iOpener and lay it lengthways on the rear case, directly over the logic board.
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Wait a couple minutes for the adhesive to soften, then remove the iOpener and move on to the next step.
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