Hi Dominik,

after a lot of research, you can add your description as follows:

yellow point: USI (likely) 6S03V100 (purpose: unknown)

green point: Murata 438 AkLNA Low Noise Amplifier (probably low-band) [dt. Leistungsverstärker]

blue point : HiSilicon Hi5H12 + Hi6H12 LNA/RF Switch

furthermore (not framed on your foto): HiSilicon Hi6H11 LNA/RF Switch (maybe you can frame it blue like the other LNA/RF Switches above)

furthermore (not framed on your foto): Murata 446 XnAWB Wideband Amplifier (mid- and highband) [dt. Leistungsverstärker]

- The green framed ICs (438 AkLNA 120514 + 446 XnAWB 040039) are quite likely from Murata (> according to the Teardown of de Mate 30 Pro of TechInsights…)

- The light blue framed ICs (6H12 V1GP163024 + 6H12 V1HP510025 + 6H12 V1HP510025) are from HiSilicon (Huawei Subsidiary)

- Pretty obviously, the Chengyan K3LK3K3 is produced from SEC (Samsung Electronics Corporation)

- The two most interesting facts:

1. no components of a US company like Skyworks, Qorov, Qualcomm, Cirrus Logis, TI, …)

2. a lot of the HiSilicon IC’s are - for the first time - produced in mainland China (Shortcut: “CN” at the end of the type description)

Question: Can you give us more details about the fingerprint sensor (Goodix or Synaptics) ? My guess is Goodix (‘cause it’s extraordinarily flat > perhaps “Goodix Ultra-Thin…” like in the P40 Pro that’s has the pritty much same PCB design)

About the fingerprint sensor: It should say SYNAPTICS S3909 and not Synopsis (EDA tools) and so the statement from other websites that it is free from US components is just wrong. Apart from the fact that the 5G version of the Mate 30 Pro contains even more US parts (TI, Qualcomm, Cirrus Logic)…