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HTC Surround Teardown

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正翻译步骤 13

步骤 13

HTC Surround Teardown: 步骤 0 中的图像 1，1

And on the back of the lower motherboard:
Qualcomm PM7540 power management IC
Skyworks SKY77336 power amplifier module
Audience A1026 voice processor, used in conjunction with the two microphones.
One of the two speakers used to project stereo sound through the Surround's speaker grille.
Once again, all three chips are identical to those found inside the Nexus One. If it ain't broke, why fix it?

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