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正翻译步骤 9

步骤 9
New shape, same dual-layer design and separation procedure. With a whole lot of concentrated heat and just a little prying, the top board peels off of the interconnect board. We get a glimpse of the lauded A13 processor, plus a ton of other silicon bits jammed onto these tiny boards.
  • New shape, same dual-layer design and separation procedure.

  • With a whole lot of concentrated heat and just a little prying, the top board peels off of the interconnect board.

  • We get a glimpse of the lauded A13 processor, plus a ton of other silicon bits jammed onto these tiny boards.

虽然这代iPhone的主板外形变了,但仍然是之前的双层设计,分开它们的办法也相同。

施加了大大的热量和小小的力量之后,上层板从带有SIM卡槽的下层板上分开了。

我们见到了被加以称赞的A13处理器,以及在这小板子上密密麻麻的其他元件。

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