跳到步骤＃24
由 Evan Noronha — 编辑
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步骤行
| + | [* icon_note] In the next steps, you will use an iOpener to apply heat to the rear case of the iPad to soften adhesive holding the logic board in place. |
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| + | [* icon_note] As you reheat and place the iOpener in each of the indicated locations, leave it in place for at least a minute to soften the adhesive through the rear case. |
| + | [* red] The adhesive is in the form of XXX pieces of black foam tape—refer to this step as you work at heating and prying to keep track of where each piece is located. |
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