让我们来看看牛7啊不note7的一些基本规格吧：

5.7寸的 Super AMOLED 曲面屏，分辨率2560 × 1440，518PPI。第五代大猩猩屏幕。

CPU是晓龙820，4G运存和高通530GPU

1200万像素搭载OIS光学防抖的相机，支持4K ,前置摄像头为500万像素，支持1080P

64GB的内存，支持扩展最高容量为256GB的MicroSD 卡

虹膜解锁和指纹解锁

Spend手写笔，type-C的USB接口和一个耳机接口

防尘和防水等级为IP68

开始拆解前让我们好好把玩下吧

耳机接口

USB-C接口

麦克风

话筒

当然少不了Spen了，开始拆解前我们要先取下Spen

尽管我们的拆机工程师希望能尽快着手拆机工作，我们还是花了一点时间完整测试了下S pen。

第一印象：S Pen和微软Surface Pen和苹果Apple Pencil形成了鲜明的对比：

S Pen更小巧（而且是手机自带），但是它同时具有 360hz的扫描率和4096级压感，而Apple Pencil只有240hz，Surface Pen仅有1024级的压感

如果打开被胶水顽固黏贴的三星设备是奥运会的项目，我们的拆机办公室肯定挂满了金牌。

我们用iOpener花了一分钟时间加热软化了玻璃后盖下的黏合剂

乓乓！枪响了，时间到。我们飞奔过去开始拆解。iSclack在手。我们扫除了最初的阻碍。一下子！ 玻璃后盖从机身上移除了. -哇喔！ 剩下的黏合剂再也粘不住了. - 哈哈! 我们进去了。

拆解手大爱Philips螺丝刀。 看着这些熟悉的精美的螺丝，我们的注意力集中到了它所固定的东西：一个酷毙了的无线充电线圈。

我们推测NFC天线也在这个极薄的线圈里。NFC功能对于Galaxy的手机也不是个陌生的配置。

忙完了这一步， 我们终于第一次看到了Note 7后盖下的全貌。

我们偶然发现一个不常见的电池线缆设计， 乍一看就像个滑梯。 当我们注视这个弯弯的曲线时，甚至感到了一点不适。

幸运的是， 撬棒轻轻一下就把电池线缆的连接头撬起来，脱离了主板。

- 断开了电池线缆之后，我们得以继续深入研究。

第一个牺牲品： 连接着内置天线的独立的扬声器

我们几乎能听到电池对我们的嘲笑，当我们徒手用力拔出它的时候，我们明了我们已经用上所有撬棒上可以集中的力量了.

颇有意思的是，这个 3500 毫安时， 13.48 瓦时的电池比体积大致相当的 iphone 6s plus 的10.45瓦时电池要多很多电量。它只是比S7 Edge的电池短了一点, S7 Edge是13.86 瓦时。

奇怪的是，从背面的突起看， Note 7 的电池是具有整体结构的增强电池， 这也许是为了防水考虑。

拿起带有 3 个相机的主板

智能手机的前后摄像头为我们所熟知，那么第三个摄像头是什么鬼？

在此插入翻译

在此插入翻译

With the motherboard deftly extracted, we take our tweezers to the hefty main camera and line him up for closer look.

It's déjà vu all over again as we pull out what appears to be the same Sony IMX260-based main camera that we uncovered in the S7 and S7 Edge.

... And the similarities go further, all the way down to:

the Winbond Q32FWXGIG serial flash memory

STMicroelectronics L2G2IS 2-Axis MEMS OIS Gyroscope

Renesas OIS Driver

We're down to the meat and potatoes of this teardown, and it seems like Samsung unified more than their product numbering—this chipset is nearly identical to that found in the S7 and S7 Edge.

Samsung K3RG2G20CMMGCJ 4 GB LPDDR4 SDRAM layered over a Qualcomm Snapdragon 820

Samsung KLUCG4J1CB-B0B1 64 GB Universal Flash Storage 2.0

Avago AFEM-9040 multiband multimode module

NXP PN67T NFC controller

Qorvo QM78064 high band RF fusion module, TQF6260 front-end module and QM63001A diversity receive module

Qualcomm WCD9335 audio codec and DSP Group DBMD4 audio/voice processor

Murata FAJ15 front-end module

More note-worthy chips hide on the backside:

Samsung 3420S7 G707A3 Wi-Fi module (most likely contains a Broadcom BCM4359 Wi-Fi SoC)

Wacom W9018 touch control IC

ZF10 110630 0625 (likely NXP Semiconductor I/O expander)

Qualcomm PM8996 and PM8004 PMICs

Qualcomm QFE3100 envelope tracker

Qualcomm WTR4905 and WTR3925 RF transceivers

IDT P9221S wireless power receiver (likely an iteration of IDT P9220) + Samsung S2MPB02 camera power management + Maxim Integrated MAX77838 power management IC

IC identification, pt. 2:

Infineon (previously Cypress Semiconductor) CY8CMBR3145 capacitive touch button controller

Samsung Image Processor (likely)

Samsung S2MM005X01 power management

Maxim Integrated MAX77854F power management

Maxim Integrated MAX98506 audio amplifier

Texas Instruments BQ25898S battery charger

ON Semiconductor FPF3688 load switch

IC identification, pt. 3:

RDA Microelectronics RDA6213 FM radio transceiver

Antenna switch module (likely)

NXP Semiconductor BGU8103 GPS/GLONASS/Galileo/BeiDou low noise amplifier

NXP Semiconductor BGS8H2 LTE low noise amplifier

NXP Semiconductor BGS8L2 LTE low noise amplifier

NXP Semiconductor BGS8M2 LTE low noise amplifier

Infineon BGS12SN6 SPDT RF switch

IC identification, pt. 4 (sensors):

Maxim Integrated MAX86902 heart rate sensor (likely)

STMicroelectronics LSM6DS3 3-axis accelerometer/gyroscope

Bosch Sensortec BMP280 pressure sensor

AKM Semiconductor AK09916 3-axis electronic compass

Seiko Instruments S-5712CCDL1-I4T1U hall effect sensor

Heading south, we hit the modular headphone jack—ready to let the music flow while keeping water out, with a nice sealing gasket.

The USB-C port is new to the Note line—and while reversibility is handy, change is hard. Samsung kindly includes a micro-USB-to-C adapter to keep your cables relevant.

Out goes the daughterboard array! Unlike the one found in the S7, this board used rigid PCB interconnects. This keeps the spidery cable from being flimsy. No one likes flimsy.

IC identification:

Qualcomm QFE2550 antenna tuner

Seiko Instruments S-5712CCDL1-I4T1U hall sensor

Semtech SX9320 proximity sensor (likely)

If you like tiny heat pipes, Note7 has you covered. This looks like the same "liquid cooling" copper heat dispersal apparatus we pulled from the vanilla S7 and S7 Edge.

Nearby, a note-able amount of glue secures this plastic cover over the S Pen chamber. It's probably there to help ingress-proof the stylus' slot.

Inside, a simple clip grabs the S Pen notches, and a gray rubber bumper protects the nib.

The volume buttons look pretty complicated, but that doesn't slow us down. Braced with years of experience plucking our unibrows, we dive in, a pair of tweezers in hand.

First out are the microswitches, followed by a reinforcement bracket full of rubber gaskets. Not quite the same, but similar to another waterproofing approach we've seen.

But...what's this? The button covers are oddly trapped within the outer case. We can't pop them out!

We're down to slim pickings, and the last component to surrender is this front-facing sensor array containing:

Status LED

IR blaster to enable iris scanning

Proximity sensor (AMS TMD4904 likely)

And here's the moment you've been waiting for—the exploded (edit: no pun intended) diagram of the Note7.