跳转到主内容

修复你的物品

维修的权力

商店

注:你正在编辑的一份前提条件指南。你所做的任何更改将影响包括此步骤的13指南

英语
西班牙语

正翻译步骤 2

步骤 2
Remove the shield plate from the device. A thick pink thermal compound bridges the gap between the shield plate and the copper heat sink underneath. For best results, whenever the shield plate is removed, refer to our thermal paste guide to remove the old thermal compound and replace it with an appropriate, thick compound such as K5 Pro during reassembly. A thick pink thermal compound bridges the gap between the shield plate and the copper heat sink underneath. For best results, whenever the shield plate is removed, refer to our thermal paste guide to remove the old thermal compound and replace it with an appropriate, thick compound such as K5 Pro during reassembly.
  • Remove the shield plate from the device.

  • A thick pink thermal compound bridges the gap between the shield plate and the copper heat sink underneath. For best results, whenever the shield plate is removed, refer to our thermal paste guide to remove the old thermal compound and replace it with an appropriate, thick compound such as K5 Pro during reassembly.

Separa la placa protectora del dispositivo.

Un compuesto adhesivo térmico denso y de color rosado rellena el espacio entre la placa protectora y el disipador de calor cúprico que se encuentra debajo. Usa la guía para aplicar pasta térmica para eliminar los restos antiguos de la misma y sustituirla por una nueva, como por ejemplo de la marca K5 Pro.

在开源创作共享许可协议下,你的投稿已被许可