Metal re-ball stencil or nonmetal
Which do you like metal re-ball stencils or nonmetal and please explain why
发售于2016年9月16日。型号为1660、1778。有 GSM 或者 CDMA 网络制式可选。提供32、128或者256GB 的存储空间。提供玫瑰金色、金色、银色、黑色和亮黑色。
I personally like metal stencils. It offers the advantage of using solder paste which can then be spread on the stencil like butter on bread. Then the solder paste can be transferred to the ball grid array with heat while the stencil is still on top of whatever you are soldering too. It has an advantage over non metal because you don't need to find the proper size of solder balls to manually load each ball 1 by 1 onto your stencil to then transfer to your grid array. You also don't need sticky flux to keep the solder balls in place after lifting up the stencil. In the end metal stencils are less tedious and less prone to error.
Metal stencil use example: https://www.youtube.com/watch?v=3_DsWcg0...
As for non metal, it’s hard to find an example because it’s an old and inefficient way of completing a re-ball task. The flow goes as follows: