Skip to main content

注:你正在编辑的一份前提条件指南。你所做的任何更改将影响包括此步骤的指南

英语
中文

正翻译步骤 7

Step 7
Next we will cover a moderately difficult soldering application.  In our case, we will be soldering very thin and delicate leads to a circuit board with small solder pads.
Intermediate Guide
  • Next we will cover a moderately difficult soldering application. In our case, we will be soldering very thin and delicate leads to a circuit board with small solder pads.

  • Small electronic components, including wires, cannot dissipate heat as quickly as larger components. This makes them very susceptible to overheating. Make sure to heat the connection just long enough to melt the solder.

  • The leads were removed from the solder pads by heating the joint on the top side of the board, while pulling out the leads with a pair of tweezers.

接下来我们将介绍一个中等困难的焊接。 在我们的例子中,我们将焊接非常薄而精细的导线到电路板。

包括电线在内的小型电子元件不像较大的组件那样能够快速散热。 这使得它们非常容易过热。 确保加热连接处融化焊料的时间恰到好处。

通过加热电路板的顶部的接头,同时用镊子拉出导线,将引线从焊盘上取下。

在开源创作共享许可协议下,你的投稿已被许可