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正翻译步骤 4

步骤 4
Set the motherboard on a support so that the CPU and GPU are completely supported and level. The support should be something that can resist temperatures upwards of 300 degrees Celsius. Suggestions: scrap lumber, old books, cardboard box.
  • Set the motherboard on a support so that the CPU and GPU are completely supported and level.

  • The support should be something that can resist temperatures upwards of 300 degrees Celsius. Suggestions: scrap lumber, old books, cardboard box.

  • In the next few steps, you will be reflowing the solder under the chips marked in red.

  • Once you begin reflowing the chips, do not touch or move the motherboard until it is completely cool. Doing so can render the motherboard irreparably damaged.

将主板放置在支架上,使 CPU 和 GPU 得到完全的支撑和水平等高。

这个支架需要可以抵抗 300 摄氏度以上的温度。 建议:废木,老书,纸箱等。

在接下来的几个步骤中,你将在标有红色的芯片下重新焊接焊料。

一旦你开始焊接芯片,不要触摸或移动主板,直到它完全冷却。 这样做可能会导致主板不可修复地损坏。

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