英语
中文

正翻译步骤 13

步骤 13
E pluribus unum. Here are the many chips that make up the One:
  • E pluribus unum. Here are the many chips that make up the One:

  • Samsung K3QF7F70DM-QGCF 3 GB LPDDR3 RAM; Qualcomm Snapdragon 801 likely layered beneath

  • Qualcomm WCD9320 Audio Codec

  • AGD2 2402 WX9DR (likely gyroscope)

  • Qualcomm PM8941 and PM8841 Power Management ICs Quick Charge 2.0 capable

  • 8407 CEH 05KTJ

  • B02419

  • P0911 3193

众和为一 由许多芯片构成的一体

三星K3QF7F70DM-QGCF 3GB LPDDR3 RAM; 高通骁龙801可能在分层下面

高通WCD9320音频编解码器

AGD2 2402 WX9DR(可能是陀螺仪)

高通PM8941PM8841电源管理ICs 快充2.0

8407 CEH 05KTJ

B02419

P0911 3193

在开源创作共享许可协议下,你的投稿已被许可