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正翻译步骤 14

步骤 14
We've quickly run out of snappy Latin catchphrases—but chips? Not even close! The backside of the board contains:
  • We've quickly run out of snappy Latin catchphrases—but chips? Not even close! The backside of the board contains:

  • Toshiba THGBMBG9D8KBAIG eMMC 5.0 64 GB Onboard Storage

  • Skyworks SKY77629-21 Power Amplifier Module

  • Qualcomm WCN3680 802.11ac/FM/BT 4.0 Combo Chip

  • Qualcomm WTR1625L RF Transceiver

  • Skyworks SKY85709 WLAN Front-End Module

  • Synaptics S3508A Touchscreen Controller

我们很快就用完了拉丁语的口吻,但芯片呢?还没接近呢!背面包含:

东芝THGBMBG9D8KBAIG eMMC 5.0 64 GB机载存储

Skyworks SKY77629-21功率放大器模块

高通WCN3680 802.11ac / FM / BT 4.0组合芯片

高通WTR1625L射频收发器

SkyworksSKY85709WLAN前端模块

Synaptics S3508A触摸屏控制器

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