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正翻译步骤 15

步骤 15
Next up, out come the guts: button sensors, motherboard, haptic drivers, and adaptive triggers, all mounted to a black midframe. From this perspective, it's pretty clear how much faith Sony has in the DualSense's fancy upgrades. Half of the internal volume is dedicated to the triggers and haptics! Both adaptive trigger assemblies connect with cables, but the haptic drivers, USB-C port, and joysticks are all held down by soldered connections.
  • Next up, out come the guts: button sensors, motherboard, haptic drivers, and adaptive triggers, all mounted to a black midframe.

  • From this perspective, it's pretty clear how much faith Sony has in the DualSense's fancy upgrades. Half of the internal volume is dedicated to the triggers and haptics!

  • Both adaptive trigger assemblies connect with cables, but the haptic drivers, USB-C port, and joysticks are all held down by soldered connections.

  • On the backside lives the main circuit board. And where there's a circuit board, there are chips:

  • SIE CXD9006GG — Likely a custom Sony chip doing all the grunt work

  • Dialog DA9087 PMIC

  • Realtek ALC5524 audio codec

  • Nuvoton NAU8225 3.0 W Class-D Audio Amplifier

接下来,胆量就大了:按钮传感器,主板,触觉驱动器和自适应触发器都安装在黑色中框上。

从这个角度来看,很明显,索尼对DualSense的高级升级有多大的信心。内部音量的一半专用于触发器和触觉!

两个自适应触发器组件均通过电缆连接,但触觉驱动器,USB-C端口和操纵杆均通过焊接连接压紧。

主电路板位于背面。在有电路板的地方,有芯片:

SIE CXD9006GG —可能是定制的索尼芯片,可以完成所有艰苦的工作

对话框DA9087 PMIC

Realtek ALC5524音频编解码器

新唐NAU8225 3.0 W D类音频放大器

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