视频概述
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为了给你带来这一次拆解,我们勇敢地到当地 GameStop 排队到了午夜。让你没有任何代价地享受这一次的拆机之旅。
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根据最新的消息,任天堂 3DS XL 2015 技术规格如下:
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“超级稳定的3D面部跟踪”
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添加了C摇杆以及新的ZL与ZR两个按键
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内置近场通讯(NFC)读取器
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改进了CPU的性能
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升级了前置摄像头并支持使用 microSDHC
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主板时间!
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任天堂1446 17 CPU LGR A (定制CPU,应该是ARM架构)
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Atheros AR6014G-AL1CWi-Fi 芯片
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三星 KLM4G1YEMD-B031 4 GB eMMC闪存
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富士通 82MK9A9A 7LFCRAM 1445 962 FCRAM (快速循环随机存储器)
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德州仪器93045A4 49AF3NW G2 (可能是电源管理 IC)
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瑞萨电子 UC KTR 442KM13 TK14
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43条评论
Anyone know if some 3rd party will make case bottoms with a SD card slot on the side via a simple cable?
Not until someone knows how to reverse engineer the motherboard and the MicroSDHC card slot PCB parts. After that, 3rd party components will be available, but it's still risky business/corporate-wise.
Looking at console replacement cases theres not much to do other than match up screw holes and the MICROSD card itself is done via a ribbon/super flat cable connected to A MICRO or normal SD port on the side of the replacement case, no need to rebuild the electronics since its just an extension to the MICROSD port. The replacement case would be a slightly different size but exterior size is not that big of an issue.