Battery removal was really easy on a mid 2014 model. Nicely written section. One thing noted was the trackpad. It is a stainless steel metal plate vs. being plastic. Secondly, the interesting aspect is the entire plate is coated with something. It is not from the battery adhesive strips. This appears to be either an adhesion promoter or, it is a non-conductive coating used for anti corrosion or, possibly to prevent shorting across the two cell pouches when used as a possible failsafe mechanism.
This coating however, is easily dissolved with Acetone. I don’t know if the 2013 model or early 2014 model sports this design but, a mid-2014 model, SN C02P67C1G3QC, has the stainless steel trackpad underside.
To the user who informed people to place paper over the logic board, that is a very bad idea due to ESD reasons. Paper is an ESD generator and can induce failure into the CCA components. Please use an ESD bag - in particular, the silver colored shielding bags and use ESD safe tape as tape is a huge ESD generator.
On this process step, there are two fasteners on the Mag-Safe already removed but not listed in the procedure. The two Mag-Safe fasteners securing the CCA to the chassis must also be removed as this is wired to the logic board underneath. If the user isn’t instructed to remove these fasteners and attempts to flip the CCA, damage may incur to the interconnects.
On a 2014.5 model, the board cannot flip up as shown. One must grab the CCA opposite of the Mag-Safe end and walk the logic board CCA up while sliding it to free the connectors from chassis.
On a 2014.5 design, these instructions should be revised on this process. The heat pipe needs to be removed first if one were to remove the I/O CCA, Reason being, the CCA is installed first into the case and then the heat pipe contact tab lays atop the CCA under the plastic injection molded part. This injection molded piece part secures the tab to the CCA to ensure optimal contact thus, ensuring heat is wicked away from the CCA.
So when I see comments regarding how it is easier to install than remove, that is an indicator that the user was unaware of how to correctly assemble this component thus, the CCA top side substrate is sitting below the heat pipe tab vs. the other way around.
This will induce a thermal issue on the I/O CCA and also, possibly short out the board when the conformal coating and painted surface of the heat pipe wears off due to vibration when cables are connected.
While I like these instructions, I would overhaul them and revise them.