From a boardlevel repair perspective I sense this is mostly game over.
Separation of the two layers requires an amount of heat applied to the whole structure pretty much all soldering folks would consider unsafe including myself.
Lets all hope very strong that this design improves mechanical stability to a point where we wont have breaking solder joints any more and improved circuitry preventing most common damages. The level and style of catch up game with the repair industry apple plays here is disconcerting.
After settling with recent macs not to be considered buyable because of &&^&^$^ all components being soldered in and tethered added to ridiculous toylike features driving stupid prices now the iPhone is also beyond what I am willing to accept for such money.
Its depressing to see how fast apple from year to year is becoming more about profit and money and less about tech and users.