正翻译步骤 10
步骤 10
-
Removal of the back of the keyboard was done using a heat gun and a scalpel.
-
Heating the board quickly warps and destroys it.
-
Glue is all over the bottom plate. It was separated by pulling it apart and slicing the glue with a scalpel.
您的所有投稿皆享有基于开源创作共享许可协议（CC BY-NC-SA）的著作权利。