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HTC Surround Teardown

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步骤 12
HTC Surround Teardown: 步骤 0 中的图像 1,1
  • Big players on the front of the lower motherboard include:

  • Qualcomm RTR6285 multi-band UMTS/EGPRS transceiver with integrated GPS

  • Qualcomm Snapdragon QSD8250 1GHz RISC microprocessor with embedded DSP.

  • Samsung KA100O015E-BJTT 512 MB NAND Flash + 512 MB SDRAM chip

  • Like most smartphones, the Surround utilizes dual microphones to cancel background noise during phone conversations. The lower microphone can be seen near the Micro-USB port.

  • The chips are identical to those found inside the Nexus One.

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