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在此拆机指南中使用的工具

简介

I have tried to include as much detail as possible in this teardown. I have even inspected the chips on the mainboard! Thanks for looking, and I hope you find this useful.

这个拆解是不是维修指南。 要维修你的的LG GW300,请使用我们的维修手册

  1. Found this phone lying around, so decided to make a teardown of it!
    • Found this phone lying around, so decided to make a teardown of it!

  2. First, remove the backplate by pushing the button at the top of the back of the phone.
    • First, remove the backplate by pushing the button at the top of the back of the phone.

  3. From here there are six screws we have to remove. But first... lemme take a battery out! But first... lemme take a battery out!
    • From here there are six screws we have to remove.

    • But first... lemme take a battery out!

  4. Get a thin opening tool and slide it around the bezel of the device.
    • Get a thin opening tool and slide it around the bezel of the device.

    • Make sure you put it in the correct place, behind the silver bezel of the front of the phone!

  5. The front and back of the device should separate.
    • The front and back of the device should separate.

    • Two buttons should come off after you have removed the back.

    • This is the rear speaker.

  6. Both of these buttons need to be pried from the front casing to allow the mainboard to come away from the front housing. These buttons are soldered to the mainboard so make sure you don't break them! The front speaker also has to be pried from the front housing.
    • Both of these buttons need to be pried from the front casing to allow the mainboard to come away from the front housing.

    • These buttons are soldered to the mainboard so make sure you don't break them!

    • The front speaker also has to be pried from the front housing.

  7. The main board can then be lifted from the front housing. The main board can then be lifted from the front housing.
    • The main board can then be lifted from the front housing.

  8. The buttons on the front housing can then be pushed out through the back of the housing.
    • The buttons on the front housing can then be pushed out through the back of the housing.

  9. The EMI shield can be removed by unclipping the clips on the side of the device. The EMI shield can be removed by unclipping the clips on the side of the device.
    • The EMI shield can be removed by unclipping the clips on the side of the device.

  10. In the centre of the picture is the vibration module. It can be unclipped to remove it. In the centre of the picture is the vibration module. It can be unclipped to remove it.
    • In the centre of the picture is the vibration module. It can be unclipped to remove it.

  11. The LCD ribbon cable and connector are under a plastic sheet that has to be removed. The ribbon cable can then be take out of the connector The ribbon connector is very fragile, so be careful when lifting the lever.
    • The LCD ribbon cable and connector are under a plastic sheet that has to be removed.

    • The ribbon cable can then be take out of the connector

    • The ribbon connector is very fragile, so be careful when lifting the lever.

  12. Use a thin opening tool to separate the LCD from the main board. Do this slowly and carefully as the screen can easily crack or bleed.
    • Use a thin opening tool to separate the LCD from the main board.

    • Do this slowly and carefully as the screen can easily crack or bleed.

  13. Chip inspection time!
    • Chip inspection time!

    • Mediatek ARM MT6A01AA

    • Samsung K5D1H12ACC-A075 NAND flash memory

    • Skyworks Solutions SKY77524-15

    • CSR 51E130A14U

James

于2012年09月30日注册

172 信誉积分

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