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正翻译步骤 5

步骤 5
The battery on the fourth generation Touch is attached via solder pads with small holes that go through the battery ribbon cable and attach to flat pads on the face of the logic board. In this step, you will heat each solder pad individually while using a metal spudger to pry it up from the logic board. DO NOT bridge the connection between the solder pads both on the board and on the ribbon cable with your spudger. Shorts have the potential to ruin the logic board. Beware of overheating the board and the cable. Only hold the tip of the iron against the pad long enough to let the solder melt. Excess heat buildup has the potential to ruin the logic board or melt the ribbon cable.
  • The battery on the fourth generation Touch is attached via solder pads with small holes that go through the battery ribbon cable and attach to flat pads on the face of the logic board. In this step, you will heat each solder pad individually while using a metal spudger to pry it up from the logic board.

  • DO NOT bridge the connection between the solder pads both on the board and on the ribbon cable with your spudger. Shorts have the potential to ruin the logic board.

  • Beware of overheating the board and the cable. Only hold the tip of the iron against the pad long enough to let the solder melt. Excess heat buildup has the potential to ruin the logic board or melt the ribbon cable.

  • Start working from the outside of the battery ribbon cable. Heat the outermost solder pad while gently prying up from under the ribbon cable to free it from the board. Repeat this process for each of the two remaining pads, working from the outside in.

第四代Touch上的电池通过带有穿过电池带缆的小孔的焊盘连接,并连接到电路板正面的平垫上。 在此步骤中,您将使用金属撬棒单独加热每个焊盘,从电路板上撬起它。

不要用电缆将电路板上和带状电缆上的焊盘连接起来。 短路有可能烧坏电路板。

谨防电路板和电缆过热。 只要把铁的尖端对着焊盘保持足够长的时间,以使焊料融化。 过多的热量积聚有可能破坏电路板或熔化带状电缆。

从电池带状电缆的外部开始操作。 加热最外面的焊盘,同时轻轻地从带状电缆下面撬起,从板上释放。 然后剩下的两个垫子重复这个过程,从外面操作。

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