跳转到主内容

注:你正在为你刚才查阅的指南编辑前提条件。你所做的任何更改将影响包括此步骤的5本指南

英语
中文

正翻译步骤 4

步骤 4
Slide the opening pick up both sides of the device in the small space between the midframe and the rear case to release the clips holding it in place. Note that the clips are not released by sliding through them, but rather the inward pressure the opening pick creates as it enters the gap around them. If the clasps fail to come undone, try pushing the edge you're working on inward with your hand, or using a thicker tool like a spudger.
  • Slide the opening pick up both sides of the device in the small space between the midframe and the rear case to release the clips holding it in place.

  • Note that the clips are not released by sliding through them, but rather the inward pressure the opening pick creates as it enters the gap around them.

  • If the clasps fail to come undone, try pushing the edge you're working on inward with your hand, or using a thicker tool like a spudger.

  • Do not attempt to remove the midframe yet! There is still a fragile ribbon cable underneath connecting the earpiece speaker to the motherboard.

将打开工具楔入位于手机左上角的缝隙之中。

将开口工具滑过装置的接缝并提起中间框架。

听到咔嗒声是正常的,因为卡口扣住中间框架。

抬起中间框架时,小心不要损坏连接听筒扬声器和主板的排线。

[* red] Wedge an opening tool into the notch that is located at the top left part of the phone.
[*
black] Slide the opening tool across the seampick up both sides of the device in the small space between the midframe and lift the mid-frame.
[*
rear case to release the clips holding it in place.
[*
icon_note] Hearing clicksNote that the clips are not released by sliding ''through'' them, but rather the inward pressure the opening pick creates as you liftit enters the mid-frame off is normal because ofgap ''around'' them.
[* icon_note] If
the clasps holding it downfail to come undone, try pushing the edge you're working on inward with your hand, or using a thicker tool like a spudger.
[* icon_caution] When lifting the mid-frame, be carefulDo not attempt to damageremove the midframe yet! There is still a fragile ribbon cable underneath connecting the earpiece speaker to the motherboard.
[* red] Wedge an opening tool into the notch that is located at the top left part of the phone.
[*
black] Slide the opening tool across the seampick up both sides of the device in the small space between the midframe and lift the mid-frame.
[*
rear case to release the clips holding it in place.
[*
icon_note] Hearing clicksNote that the clips are not released by sliding ''through'' them, but rather the inward pressure the opening pick creates as you liftit enters the mid-frame off is normal because ofgap ''around'' them.
[* icon_note] If
the clasps holding it downfail to come undone, try pushing the edge you're working on inward with your hand, or using a thicker tool like a spudger.
[* icon_caution] When lifting the mid-frame, be carefulDo not attempt to damageremove the midframe yet! There is still a fragile ribbon cable underneath connecting the earpiece speaker to the motherboard.

在开源创作共享许可协议下,你的投稿已被许可