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注:你正在编辑的一份前提条件指南。你所做的任何更改将影响包括此步骤的3指南

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正翻译步骤 2

步骤 2
Wedge the edge of a plastic opening tool underneath the SIM Card board and motherboard. Pry the clips located near the right bottom edge of the SIM Card board up off the motherboard. Repeat the process all along the bottom perimeter of the SIM Card board until all clips have been disengaged.
  • Wedge the edge of a plastic opening tool underneath the SIM Card board and motherboard.

  • Pry the clips located near the right bottom edge of the SIM Card board up off the motherboard.

  • Repeat the process all along the bottom perimeter of the SIM Card board until all clips have been disengaged.

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在此插入翻译

在此插入翻译

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