跳转到主内容

修复你的物品

维修的权力

商店

英语
中文

正翻译步骤 9

步骤 9
We push the cameras off to the side in order to pore over this motherboard's silicon. Our findings include:
  • We push the cameras off to the side in order to pore over this motherboard's silicon. Our findings include:

  • Samsung K3UH5H50MM-NGCJ 4 GB LPDDR4 RAM layered over the MSM8998 Snapdragon 835

  • Toshiba THGAF4G9N4LBAIR 64 GB UFS (NAND flash + controller)

  • Qualcomm Aqstic WCD9341 audio codec

  • Skyworks SKY78160-11 front-end module w/ LNA

  • Avago AFEM-9066 front-end module

  • Qualcomm QET4100 envelope tracker

  • Silicon Mitus SM5720 Interface PMIC

我们将相机放在一边,以便取下覆盖该主板的硅片。 我们的研究结果包括:

三星K3UH5H50MM-NGCJ 4GB LPDDR4覆盖在 MSM8898 骁龙835 CPU上面

东芝THGBF4G9N4LBAIR 64GB UFS(闪存+控制器)

高通Aqstic WCD9341媒体解码器

Skyworks 78160-11

安华高AFEM-9066

[* black] We push the cameras off to the side in order to pore over this motherboard's silicon. Our findings include:
[* red] Samsung [http://www.samsung.com/semiconductor/products/dram/mobile-dram/low-power-ddr4x/K3UH5H50MM-NGCJ?ia=3157|K3UH5H50MM-NGCJ|new_window=true] 4 GB LPDDR4 RAM layered over the [https://www.qualcomm.com/products/snapdragon/processors/835|MSM8998|new_window=true] Snapdragon 835
[* orange] Toshiba [https://toshiba.semicon-storage.com/eu/product/memory/nand-flash/mlc-nand/ufs.html|THGAF4G9N4LBAIR|new_window=true] 64 GB UFS (NAND flash + controller)
[* yellow] Qualcomm Aqstic [https://www.qualcomm.com/news/releases/2017/01/03/qualcomm-snapdragon-835-mobile-platform-power-next-generation-immersive|WCD9341|new_window=true] audio codec
[* green] Skyworks 78160-11SKY78160-11 front-end module w/ LNA
[* light_blue] Avago AFEM-9066 front-end module
[* blue] Qualcomm [link|https://www.qualcomm.com/news/releases/2016/02/17/qualcomm-technologies-announces-next-generation-qualcomm-rf360-front-end|QET4100] envelope tracker
[* green] Skyworks 78160-11SKY78160-11 front-end module w/ LNA
[* light_blue] Avago AFEM-9066 front-end module
[* blue] Qualcomm [link|https://www.qualcomm.com/news/releases/2016/02/17/qualcomm-technologies-announces-next-generation-qualcomm-rf360-front-end|QET4100] envelope tracker
[* violet] Silicon Mitus SM5720 Interface PMIC

在开源创作共享许可协议下,你的投稿已被许可