正翻译步骤 9
步骤 9
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We push the cameras off to the side in order to pore over this motherboard's silicon. Our findings include:
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Samsung K3UH5H50MM-NGCJ 4 GB LPDDR4 RAM layered over the MSM8998 Snapdragon 835
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Toshiba THGAF4G9N4LBAIR 64 GB UFS (NAND flash + controller)
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Qualcomm Aqstic WCD9341 audio codec
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Skyworks SKY78160-11 front-end module w/ LNA
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Avago AFEM-9066 front-end module
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Qualcomm QET4100 envelope tracker
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Silicon Mitus SM5720 Interface PMIC
| [* black] We push the cameras off to the side in order to pore over this motherboard's silicon. Our findings include: |
| [* red] Samsung [http://www.samsung.com/semiconductor/products/dram/mobile-dram/low-power-ddr4x/K3UH5H50MM-NGCJ?ia=3157|K3UH5H50MM-NGCJ|new_window=true] 4 GB LPDDR4 RAM layered over the [https://www.qualcomm.com/products/snapdragon/processors/835|MSM8998|new_window=true] Snapdragon 835 |
| [* orange] Toshiba [https://toshiba.semicon-storage.com/eu/product/memory/nand-flash/mlc-nand/ufs.html|THGAF4G9N4LBAIR|new_window=true] 64 GB UFS (NAND flash + controller) |
| [* yellow] Qualcomm Aqstic [https://www.qualcomm.com/news/releases/2017/01/03/qualcomm-snapdragon-835-mobile-platform-power-next-generation-immersive|WCD9341|new_window=true] audio codec |
| [* green] Skyworks [* light_blue] Avago AFEM-9066 front-end module [* blue] Qualcomm [link|https://www.qualcomm.com/news/releases/2016/02/17/qualcomm-technologies-announces-next-generation-qualcomm-rf360-front-end|QET4100] envelope tracker |
| [* green] Skyworks [* light_blue] Avago AFEM-9066 front-end module [* blue] Qualcomm [link|https://www.qualcomm.com/news/releases/2016/02/17/qualcomm-technologies-announces-next-generation-qualcomm-rf360-front-end|QET4100] envelope tracker |
| [* violet] Silicon Mitus SM5720 Interface PMIC |