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正翻译步骤 18

步骤 18
Let us take a look at what silicon is so heavily guarded by the charging case: STMicroelectonics STM32L072 ARM Cortex-M0+ MCU Our X-ray imagery shows some quality issues in this chip's solder joints. Empty spaces, known as voiding, could be evidence of low quality standards, or a rushed product release. Could issues with the AirPod case be what delayed release?

  • Let us take a look at what silicon is so heavily guarded by the charging case:

  • STMicroelectonics STM32L072 ARM Cortex-M0+ MCU

  • Our X-ray imagery shows some quality issues in this chip's solder joints. Empty spaces, known as voiding, could be evidence of low quality standards, or a rushed product release. Could issues with the AirPod case be what delayed release?

  • NXP 1610A3 charging IC (as seen in iPhones 6s and SE and both iPad Pro models)

  • Texas Instruments BQ24232 power management IC

让我们看看在充电盒的重重保护下，都有什么芯片：

意法半导体 STM32L072 ARM Cortex-M0+ 微程序控制器

我们的 X 光图像显示，该芯片的焊点中有一些质量问题。空隙，一般称为虚焊，可能是品控不好的证据 ，或者是因为发布太匆忙。也许这就是导致 AirPod 充电盒延迟发布的原因？

恩智浦 1610A3 充电 IC（和 iPhone 6s 和 SE，以及 iPad Pro 中的一样）

德州仪器 BQ24232 电源管理 IC

在开源创作共享许可协议下，你的投稿已被许可。