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注:你正在编辑的一份前提条件指南。你所做的任何更改将影响包括此步骤的指南

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正翻译步骤 4

Step 4
Prepare your component for soldering by removing any excess solder from the contacts. The contacts should be clean enough to pass through the solder pad holes.
  • Prepare your component for soldering by removing any excess solder from the contacts. The contacts should be clean enough to pass through the solder pad holes.

  • Run the soldering iron tip down the lengths of each contact to wipe the solder away from the component. Clean the iron's tip between strokes by wiping it against a moist sponge.

  • Excessive heat will damage the components, so do not apply the soldering iron to the component for long amounts of time.

准备已经清除了多余焊料的元件。 触点应足够清洁以穿过焊盘孔。

沿着每个触点的长度滑动烙铁头,将焊料从部件上擦去。 通过海绵将烙铁头擦拭干净,清洁烙铁铁尖。

过热会损坏组件,因此不要长时间将烙铁与组件相接触。

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