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正翻译步骤 10

步骤 10
Chips on the front of the motherboard:
  • Chips on the front of the motherboard:

  • Samsung K3RG2G20BM-MGCJ 4 GB LPDDR4 mobile DRAM with a quad-core Qualcomm Snapdragon 821 processor layered underneath (two cores clocked at 2.15 GHz and two cores clocked at 1.6 Ghz)

  • Qualcomm PMI8996 power management IC, and Qualcomm SMB1350 Quick Charge 3.0 IC

  • NXP TFA9891 smart audio amplifier

  • Qualcomm WTR4905 LTE RF transceiver

  • 3207RA G707A (looks like Wi-Fi)

  • NXP 55102 1807 S0622 (likely NFC controller)

  • Bosch Sensortec BMI160 low power IMU

主板前面的芯片:

三星K3RG2G20BM-MGCJ 4 GB LPDDR4移动平台内存颗粒,覆盖一颗高通骁龙821四核处理器(2核心频率为2.15GHz,另外2核心为1.6GHz)

高通PMI8996电源管理芯片,以及高通SMB1350 Quick Charge 3.0快充芯片

NXP TFA9891智能音频放大器

高通WTR4905LTE射频芯片

3207RA G707A(看上去像Wi-Fi芯片)

NXP 55102 1807 S0622(看上去像NFC控制芯片)

博世传感BMI160低功耗惯性测量单元

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