跳转到主内容
英语
中文

正翻译步骤 13

步骤 13
Plucking the logic board from the 7 Plus is much easier than with its predecessor. There's no need to flip over the logic board to remove the final connections. It may seem like a small victory, but we're still encouraged—even small design changes can make a difference in terms of repairability.
  • Plucking the logic board from the 7 Plus is much easier than with its predecessor. There's no need to flip over the logic board to remove the final connections.

  • It may seem like a small victory, but we're still encouraged—even small design changes can make a difference in terms of repairability.

  • Peeling up the EMI stickers, we spy what might be some additional heat management.

  • Could that be the A10 under there?

把7 Plus中的逻辑主板搞出来的过程,比它前任6s Plus容易多了。无需把逻辑主板翻过来去除最后连接。

看起来像是一个小胜利,但我们仍然充满激情——即使是设计上的小改变也可以让手机的可修复性有大幅提高。

揭开EMI屏蔽贴纸,我们侦查到可能是一些额外的热处理管理件。

那下面可能是A10吗?

在开源创作共享许可协议下,你的投稿已被许可