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正翻译步骤 13

步骤 13
Plucking the logic board from the 7 Plus is much easier than with its predecessor. There's no need to flip over the logic board to remove the final connections. It may seem like a small victory, but we're still encouraged—even small design changes can make a difference in terms of repairability.

  • Plucking the logic board from the 7 Plus is much easier than with its predecessor. There's no need to flip over the logic board to remove the final connections.

  • It may seem like a small victory, but we're still encouraged—even small design changes can make a difference in terms of repairability.

  • Peeling up the EMI stickers, we spy what might be some additional heat management.

  • Could that be the A10 under there?

把7 Plus中的逻辑主板搞出来的过程，比它前任6s Plus容易多了。无需把逻辑主板翻过来去除最后连接。

看起来像是一个小胜利，但我们仍然充满激情——即使是设计上的小改变也可以让手机的可修复性有大幅提高。

揭开EMI屏蔽贴纸，我们侦查到可能是一些额外的热处理管理件。

那下面可能是A10吗？

在开源创作共享许可协议下，你的投稿已被许可。