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正翻译步骤 11

步骤 11
With the motherboard plucked from the the rear case, we take a second to explore the MX6's silicon situation. Highlights include:
  • With the motherboard plucked from the the rear case, we take a second to explore the MX6's silicon situation. Highlights include:

  • Micron D9TPL 32 Gb (4 GB) Mobile LPDDR3 SDRAM with MediaTek Helio X20 SoC layered underneath

  • MediaTek MT6631N Wi-Fi Module

  • Texas Instruments BQ25892 Fast Charging IC

  • NXP TFA9911 Audio Amplifier

  • MediaTek MT6351V PMIC

  • Skyworks SKY77673-11

  • MediaTek MT6300P (Possibly an iteration of the MT6302 dual SIM card controller)

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