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正翻译步骤 6

步骤 6
Who left their gum in here? Peeling up the motherboard reveals more thermal paste in a phone than we've seen in awhile. Here are the front-side chips:
  • Who left their gum in here? Peeling up the motherboard reveals more thermal paste in a phone than we've seen in awhile.

  • Here are the front-side chips:

  • SKhynix H9CKNNNDATMU 24 Gb (3 GB) LPDDR3 RAM

  • Samsung KLMBG2JENB 32 GB eMMC flash memory

  • Texas Instruments BQ25892 fast charging IC

  • HiSilicon Hi6402 audio codec

谁把嚼过的口香糖忘在这了?取下主板后,可以看到机身上的导热硅脂比常见的手机多不少。

这是主板正面的芯片:

海力士 H9CKNNNDATMU 24Gb(3GB)LPDDR3 内存

三星 KLMBG2JENB 32GB eMMC 闪存(存储)

德州仪器 BQ25892 快充电源管理

海思(华为自有) Hi6402 音频编码解码芯片

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