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注:你正在编辑的一份前提条件指南。你所做的任何更改将影响包括此步骤的3指南

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正翻译步骤 10

步骤 10
Use a plastic opening tool to help pull the headphone jack out of its recess in the top of the rear panel.
  • Use a plastic opening tool to help pull the headphone jack out of its recess in the top of the rear panel.

  • Peel the headphone jack/SIM slot assembly away from the top edge of the communications board.

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