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正翻译步骤 11

步骤 11
We pop the pesky rear connector off the logic board, and are free to scan the silicon fields of glory! Apple A9 APL1022 SoC + SK Hynix  2 GB LPDDR4 RAM as denoted by the markings H9KNNNBTUMUMR-NLH Qualcomm MDM9625M LTE Modem (as seen in iPhone 6/6 Plus)
  • We pop the pesky rear connector off the logic board, and are free to scan the silicon fields of glory!

  • Apple A9 APL1022 SoC + SK Hynix 2 GB LPDDR4 RAM as denoted by the markings H9KNNNBTUMUMR-NLH

  • Qualcomm MDM9625M LTE Modem (as seen in iPhone 6/6 Plus)

  • Qualcomm WTR1625L RF Transceiver (as seen in iPhone 6/6 Plus)

  • Qualcomm QFE1100 Envelope Tracking IC (as seen in 6s/6s Plus, and 6/6 Plus)

  • Skyworks SKY77611 Quad-band Power Amplifier Module

  • We'd like to extend a huge thanks to our friends at Chipworks for helping us ID all of these chips! Check out their rad teardown of the iPhone SE for even more silicon goodness.

我们从逻辑板弹出讨厌的后部接口,并可随时查看我们达到的辉煌成就!

苹果A9系统芯片 APL1022 + SK海力士2 GB 内存 LPDDR4标记为H9KNNNBTUMUMR - NLH

高通MDM9625MLTE调制解调器 (和iPhone6/6 Plus一样)

高通WTR1625LRF传送接收器(和iPhone 6/6 Plus一样)

高通QFE1100包络跟踪IC (和6s/6s Plus, 6/6 Plus一样)

Skyworks SKY77611四频功率放大器模块

我们想对我们在Chipworks公司朋友表达无尽地感谢,感谢他们帮助我们辨认所有这些芯片!查看他们的拆解了解iPhone SE内部更多的芯片。

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