Skip to main content

注:你正在为你刚才查阅的指南编辑前提条件。你所做的任何更改将影响包括此步骤的5本指南

英语
中文

正翻译步骤 2

Step 2
If adhesive residue is holding the motherboard in place, use a Jimmy to cut the adhesive between the motherboard and the back of the phone.
  • If adhesive residue is holding the motherboard in place, use a Jimmy to cut the adhesive between the motherboard and the back of the phone.

  • Carefully lift the right edge of the motherboard from the phone.

  • Avoid pulling on the battery wires, which connect the left underside of the motherboard to the battery.

如果粘合剂残留物在主板上,请使用Jimmy切割主板和手机背面之间的粘合剂。

小心地从右侧边缘处提起主板。

避免拉动电池线,主板在左下方与电池相连。

在开源创作共享许可协议下,你的投稿已被许可