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正翻译步骤 6

步骤 6
Release the tabs on each side of the RAM chip by simultaneously pushing each tab away from the RAM. These tabs lock the chip in place and releasing them will cause the chip to "pop" up.
  • Release the tabs on each side of the RAM chip by simultaneously pushing each tab away from the RAM.

  • These tabs lock the chip in place and releasing them will cause the chip to "pop" up.

  • After the RAM chip has popped up, pull it straight out of its socket.

  • Repeat this process if a second RAM chip is installed.

  • Logic board remains.

  • If you need to mount the heat sink back onto the logic board, we have a thermal paste guide that makes replacing the thermal compound easy.

通过同时将每个标签从RAM中打开RAM芯片两侧的插槽。

这些标签将芯片锁定到位,打开它们将导致芯片“弹出”。

RAM芯片弹出后,将其从插槽中直接拉出。

如果安装了第二个RAM芯片,则重复此过程。

逻辑板仍然在。

如果您需要将散热安装到逻辑板上,我们有一个导热板可以更换热敏电阻。

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