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正翻译步骤 2

步骤 2
Using the plastic opening tool, gently pry apart the front and back casing panels around the edges of the device. While doing this the clips will gently be pried apart allowing you to separate the front and back casings.
  • Using the plastic opening tool, gently pry apart the front and back casing panels around the edges of the device. While doing this the clips will gently be pried apart allowing you to separate the front and back casings.

  • There is a ribbon cable that will still connect the front panel to the motherboard.

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