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正翻译步骤 10

步骤 10
Removal of the back of the keyboard was done using a heat gun and a scalpel. Heating the board quickly warps and destroys  it. Glue is all over the bottom plate.  It was separated by pulling it apart and slicing the glue with a scalpel.
  • Removal of the back of the keyboard was done using a heat gun and a scalpel.

  • Heating the board quickly warps and destroys it.

  • Glue is all over the bottom plate. It was separated by pulling it apart and slicing the glue with a scalpel.

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