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注:你正在编辑的一份前提条件指南。你所做的任何更改将影响包括此步骤的3指南

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正翻译步骤 2

步骤 2
Wedge the plastic opening tool, between the motherboard and the inner region of the phone in the slot atop the motherboard. Wedge the plastic opening tool, between the motherboard and the inner region of the phone in the slot atop the motherboard.
  • Wedge the plastic opening tool, between the motherboard and the inner region of the phone in the slot atop the motherboard.

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