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正翻译步骤 12

步骤 12
Verizon iPhone 4 logic board on top. Although it's the same form factor, this is definitely not the same board. Conspicuously absent is the SIM slot. That's freed up a lot of space for something. We'll get the EMI shields off soon enough...
  • Verizon iPhone 4 logic board on top.

  • Although it's the same form factor, this is definitely not the same board. Conspicuously absent is the SIM slot. That's freed up a lot of space for something.

  • We'll get the EMI shields off soon enough...

  • Apple used custom molded rubber bumpers between the chips and the EMI shields presumably to quell any interference between analog and digital circuitry.

Verizon iPhone4主板在顶部

虽然外形因数相同,但不是同一块主板,显而易见的是没有sim卡槽,这为一些东西腾出了空间

一会我们就把EMI屏蔽罩卸下来

苹果在EMI屏蔽罩和芯片之间用了定制的橡胶垫,应该是为了消除模拟电路和数字电路的串扰

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