跳转到主内容
英语
中文

正翻译步骤 7

步骤 7
We pull out the G4's motherboard and get a better view of its silicon. Check out these ICs: Samsung K3QF6F60AM-QGCF 3 GB LPDDR3 RAM The Hexa-Core, 1.8 GHz Qualcomm Snapdragon 808 SOC is layered beneath the RAM.
  • We pull out the G4's motherboard and get a better view of its silicon. Check out these ICs:

  • Samsung K3QF6F60AM-QGCF 3 GB LPDDR3 RAM

  • The Hexa-Core, 1.8 GHz Qualcomm Snapdragon 808 SOC is layered beneath the RAM.

  • Toshiba THGBMFG8C4LBAIR 32 GB NAND Flash

  • Broadcom BCM4339HKUBG 5G WiFi Client

  • Qualcomm PMI8994 Power Management IC

  • IDT P9025A Qi Wireless Power Receiver IC

  • Qualcomm WTR3925 LTE Transceiver

在此插入翻译

在此插入翻译

在此插入翻译

在此插入翻译

在此插入翻译

在此插入翻译

在此插入翻译

在此插入翻译

在开源创作共享许可协议下,你的投稿已被许可