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正翻译步骤 11

步骤 11
As ChipWorks noted in their recent Galaxy S6 analysis, more and more of the chips in Samsung's flagship phones seem to be originating in-house. On the front side of the mobo, we find:
  • As ChipWorks noted in their recent Galaxy S6 analysis, more and more of the chips in Samsung's flagship phones seem to be originating in-house. On the front side of the mobo, we find:

  • Samsung Exynos 7420 Octa-core Processor - 64-bit, 2.1 GHz Quad + 1.5 GHz Quad, with Samsung K3RG3G30MM-DGCH 3 GB LPDDR4 RAM layered in

  • Samsung KLUBG4G1BD 32GB NAND Flash

  • Skyworks 78041 Hybrid Multimode Multiband (MMMB) Front-End Module (FEM)

  • Avago AFEM-9020 PAM

  • Wolfson Microelectronics WM1840 Audio Codec and Maxim MAX98505 Class DG Audio Amplifier

  • Samsung N5DDPS3 - Similar to the N5DDPS2 spotted in the Galaxy S6, likely NFC Controller

  • InvenSense MP65M 6-Axis Accel + Gyro, and Samsung C2N89U (likely image processor)

ChipWorks在他们的最近的盖乐世 S6 分析中指出,看起来在三星的旗舰手机中越来越多的芯片源于in-house模式。在主板的前侧,可以看到:

三星 Exynos 7420 Octa-core 处理器 - 64位, 2.1 GHz 四核 + 1.5 GHz 四核, 及三星 K3RG3G30MM-DGCH 3 GB LPDDR4 RAM

三星 KLUBG4G1BD 32GB NAND 闪存

思佳讯(Skyworks) 78041 混合多模多频 (MMMB) 前端模块 (FEM)

安华高(Avago) AFEM-9020 PAM

欧胜微电子(Wolfson Microelectronics )WM1840 音频解码及美信(Maxim) MAX98505 DG级音频放大器

三星 N5DDPS3 - 类似在盖乐世S6上发现的N5DDPS2 , 可能是NFC控制器

应美盛(InvenSense) MP65M 6轴加速 + 陀螺仪,及三星 C2N89U (可能是图形处理器)

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