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正翻译步骤 10

步骤 10
With all of its connectors popped, the motherboard is almost free of the display—it shares the same wonky, wrong-side IO board connection that we first saw in the Galaxy S5. We pluck the main camera from the motherboard to get a better look at the hardware riding on its PCB: Winbond W25Q32FW Serial Flash Memory
  • With all of its connectors popped, the motherboard is almost free of the display—it shares the same wonky, wrong-side IO board connection that we first saw in the Galaxy S5.

  • We pluck the main camera from the motherboard to get a better look at the hardware riding on its PCB:

  • Winbond W25Q32FW Serial Flash Memory

  • InvenSense IDG-2030 dual axis gyroscope for optical image stabilization

  • The 16 MP OIS rear-facing camera dwarfs the 5 MP selfie cam.

将所有的连接器都撬开后,主板差不多要从显示框架上自由了——和我们首次在盖乐世S5上见到的一样,不可靠的反向IO板连接。

我们从主板上拔下了后置摄像头一看究竟,这块板子上的芯片:

华邦电子(Winbond) W25Q32FW 系列闪存

应美盛(InvenSense) IDG-2030 用于光学稳定的双轴陀螺仪

1600万像素的OIS后置摄像头和500万自拍摄像头。

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