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修复你的物品

维修的权力

商店

注:你正在编辑的一份前提条件指南。你所做的任何更改将影响包括此步骤的2指南

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正翻译步骤 4

步骤 4
If necessary, lift the right edge of the communications board upward to release it from the adhesive pad attached to the rear case. Pull the communications board away from its socket on the logic board.
  • If necessary, lift the right edge of the communications board upward to release it from the adhesive pad attached to the rear case.

  • Pull the communications board away from its socket on the logic board.

如果有必要,把通讯模块右边缘向上抬起,松开将其固定后盖上的胶条。

把通信模块从主板上取出来。

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