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正翻译步骤 5

步骤 5
Simultaneously push the two plastic clips on the far left and right sides of the I/O board toward the middle of the I/O board and pull the I/O board slightly away from the outer case. Pull the I/O board/logic board assembly out of the outer case a maximum of 5 mm. Pulling the assembly out further may damage the IR sensor connector (highlighted in red in the third picture). Pull the I/O board/logic board assembly out of the outer case a maximum of 5 mm. Pulling the assembly out further may damage the IR sensor connector (highlighted in red in the third picture).
  • Simultaneously push the two plastic clips on the far left and right sides of the I/O board toward the middle of the I/O board and pull the I/O board slightly away from the outer case.

  • Pull the I/O board/logic board assembly out of the outer case a maximum of 5 mm. Pulling the assembly out further may damage the IR sensor connector (highlighted in red in the third picture).

同时将I / O板最左侧和最右侧的两个塑料夹推向I / O板的中间,将I / O板稍微拉离外壳。

将I / O板/逻辑板组件从外壳拉出最多5毫米。 进一步拉出组件可能会损坏红外传感器连接器(在第三张图中以红色突出显示)。

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