跳转到主内容

注:你正在编辑的一份前提条件指南。你所做的任何更改将影响包括此步骤的2指南

英语
日语

正翻译步骤 5

Step 5
Simultaneously push the two plastic clips on the far left and right sides of the I/O board toward the middle of the I/O board and pull the I/O board slightly away from the outer case. Pull the I/O board/logic board assembly out of the outer case a maximum of 5 mm. Pulling the assembly out further may damage the IR sensor connector (highlighted in red in the third picture). Pull the I/O board/logic board assembly out of the outer case a maximum of 5 mm. Pulling the assembly out further may damage the IR sensor connector (highlighted in red in the third picture).
  • Simultaneously push the two plastic clips on the far left and right sides of the I/O board toward the middle of the I/O board and pull the I/O board slightly away from the outer case.

  • Pull the I/O board/logic board assembly out of the outer case a maximum of 5 mm. Pulling the assembly out further may damage the IR sensor connector (highlighted in red in the third picture).

在此插入翻译

在此插入翻译

在开源创作共享许可协议下,你的投稿已被许可