修复你的物品

维修的权力

商店

注：你正在为你刚才查阅的指南编辑前提条件。你所做的任何更改将影响包括此步骤的8本指南。

返回指南
英语
中文
上一步 下一步

正翻译步骤 33

步骤 33
Pry up the logic board at the lower edge of the rectangular gap, near the EMI shield. Lift the end of the logic board slowly. If you encounter significant resistance, stop prying and reapply the iOpener. Lift the end of the logic board slowly. If you encounter significant resistance, stop prying and reapply the iOpener.

  • Pry up the logic board at the lower edge of the rectangular gap, near the EMI shield.

  • Lift the end of the logic board slowly. If you encounter significant resistance, stop prying and reapply the iOpener.

在矩形间隙的下边缘，在EMI屏蔽板附近撬起主板。

缓慢提起主板的一端。如果遇到重大阻力，请停止撬动并重新使用 iOpener 融化粘合剂。

在开源创作共享许可协议下，你的投稿已被许可。