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注:你正在编辑的一份前提条件指南。你所做的任何更改将影响包括此步骤的8指南

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正翻译步骤 33

步骤 33
Pry up the logic board at the lower edge of the rectangular gap, near the EMI shield. Lift the end of the logic board slowly. If you encounter significant resistance, stop prying and reapply the iOpener. Lift the end of the logic board slowly. If you encounter significant resistance, stop prying and reapply the iOpener.
  • Pry up the logic board at the lower edge of the rectangular gap, near the EMI shield.

  • Lift the end of the logic board slowly. If you encounter significant resistance, stop prying and reapply the iOpener.

在矩形间隙的下边缘,在EMI屏蔽板附近撬起主板。

缓慢提起主板的一端。如果遇到重大阻力,请停止撬动并重新使用 iOpener 融化粘合剂。

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