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注:你正在编辑的一份前提条件指南。你所做的任何更改将影响包括此步骤的指南

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正翻译步骤 2

步骤 2
Insert the plastic opening tool in the groove at the top of the phone. Rotate the tool to create an opening between the logic board cover and case.
  • Insert the plastic opening tool in the groove at the top of the phone.

  • Rotate the tool to create an opening between the logic board cover and case.

在此插入翻译

在此插入翻译

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