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正翻译步骤 4

步骤 4
WARNING: Use extreme caution when removing and handling the logic board as it is very fragile. With caution, use a plastic prier to separate the back silver casing from the front of the phone. This may require force.
  • WARNING: Use extreme caution when removing and handling the logic board as it is very fragile.

  • With caution, use a plastic prier to separate the back silver casing from the front of the phone. This may require force.

  • Disconnect the logic board from the small orange chip.

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